Figure 1. Graphical depiction of the inverted DIW AM procedure
fabricating an arch structure under the printing platform. (a) Layer deposition of uncured two-stage resin ink onto structure. (b) Solidification of deposited layer via development of
photopolymer network facilitated by UV radiation. (c) Strengthening of printed structure through development of an
interpenetrating polymer network via autonomous ambient temperature
conversion of epoxy resin.