Figure 1. Graphical depiction of the inverted DIW AM procedure fabricating an arch structure under the printing platform. (a) Layer deposition of uncured two-stage resin ink onto structure. (b)  Solidification of deposited layer via development of photopolymer network facilitated by UV radiation. (c) Strengthening of printed structure through development of an interpenetrating polymer network via autonomous ambient temperature conversion of epoxy resin.