BAlGaN light emitting diode emitting at 350 nm
P. Milner1,2, V.Z. Zubialevich1, T.
O’Connor1,2, S.M. Singh1,2, D.
Singh1, B. Corbett1 and P.J.
Parbrook1, 2
1 Tyndall National Institute, University College
Cork, Lee Maltings, Dyke Parade, Cork, T12 R5CP, Ireland
2 Department of Electrical and Electronic
Engineering, University College Cork, Cork, T12 K8AF, Ireland
Email:
peter.milner@tyndall.ie,
p.parbrook@ucc.ie
In this work, we report the first demonstration of an ultraviolet
light-emitting diode (LED) with boron-containing multiple quantum wells.
Electroluminescence emission from the BAlGaN LED was observed at 350 nm,
with higher intensity compared to the AlGaN reference LED. A higher
operating voltage compared to the reference LED was also observed which
may be attributable to a nanomasking behaviour of boron in (Al)GaN
alloys.
Introduction: III-Nitride ultraviolet (UV) light sources are in
increasing demand to replace mercury-based lamps owing to potentially
higher efficiencies, smaller footprints, and tunable wavelengths
[1]. While significant developments have been made over the past two
decades, the performance of AlGaN-based light-emitting diodes (LEDs)
still lags behind visible (In)GaN-based devices [2, 3]. Some of the
major challenges are the crystalline quality of initial
substrates/templates, light absorption within the LED heterostructure
(due to p -GaN contact layers), lack of reflective contacts, and
large intrinsic polarisation fields across the active region [4].
These fields originate from a combination of the ionicity of the bonds
in the wurtzite lattice and the lattice mismatch in the crystal, which
result in a separation of the electron and hole wavefunctions in the
quantum wells (QWs), along with a redshift in the emission spectrum.
This effect is more commonly known as the quantum confined Stark effect
(QCSE) and is detrimental to the internal quantum efficiency (IQE) of
the device.
Wurtzite boron nitride is an ultra-wide indirect bandgap material with a
bandgap of ~6.7 eV, while the bandgap estimate for a
direct transition is ~13 eV [5, 6]. The relatively
small BN lattice constant of a ≈ 2.5 Å allows for the possibility
of lattice-matching between well and barrier/buffer material [7].
Therefore, the addition of small amounts of BN to the (Al)GaN QWs has
the potential to negate the polarisation field across the well and
reduce the QCSE, thereby increasing the IQE. However, boron-containing
QWs have to overcome many practical challenges in order to demonstrate
experimentally their potential. In this Letter, we report, to our
knowledge, the first UV LED with B-containing QWs.
Growth and fabrication: A BAlGaN MQW UVA LED was grown by
metalorganic chemical vapor deposition (MOCVD) in an AIXTRON 3×2” close
coupled showerhead reactor. A 2-inch c -plane sapphire wafer with
25 nm sputtered AlN (Kyma Technologies) was used as the substrate, onto
which a 200 nm AlN connecting layer was grown. This was followed by 400
nm u -Al0.35Ga0.65N, 1.8 μm
Al0.350.22Ga0.650.78N (upper 0.9 μmn -doped) graded composition layer, five QW/QB
Bx (Al0.06Ga0.94)1-x N
(3.5 nm)/Al0.16Ga0.84N (10 nm), 30 nm
Al0.35Ga0.65N electron blocking layer
(top 20 nm p -type doped), 50 nmp ‑Al0.350.00Ga0.651.00N, and 10
nm p -GaN contact layer. The growth temperature of the active
region was 1160°C. Trimethylgallium, trimethylaluminum, triethylboron
(TEB), and ammonia were used as the main precursors. The TEB/III ratio
for the QW was 1%. Disilane and bis-cyclopentadienyl magnesium were
used as the n - and p -type dopants, respectively. A
reference LED was also grown, with the exact same structure as above,
but with no TEB flowing during QW growth.
After growth, both samples were processed into individual LEDs. First, a
surface clean consisting of buffered oxide etchant, HCl:DI 1:1 and 45%
KOH at 100°C was carried out to prepare the p -GaN surface for
processing. Pd was evaporated as the p -metal, followed by the
formation of 100 μm diameter circular mesas by inductively-coupled
plasma etching with a Cl2-based plasma. Finally,
Ti/Al/Ti/Au was evaporated to form the n -metal.
Effects of boron incorporation: Test MQW stacks consisting of
Bx (Al0.05Ga0.95)1-x N/Al0.16Ga0.84N
with different TEB/III ratios were grown by MOCVD, and a transmission
electron microscopy (TEM) image revealed the presence of nanopipe-shaped
voids in the active region for a low TEB/III ratio (< 1%).
This effect has been attributed to boron surface segregation during
growth [8]. It is proposed that boron acts as a surfactant, reducing
the surface energy of the semipolar and nonpolar planes to below that of
polar c -plane. In between the nanopipes, the QWs are undisturbed
and show high uniformity. For the sample prepared with a higher TEB/III
ratio (3%), the QWs disappear completely due to a high concentration of
voids. Hence, for this LED experiment the TEB/III was set to 1%, using
a QW growth temperature of 1160°C.